Technical Capabilities
Min. thin core thickness
2.5 mil
Max. layer count
18 Layer
Max. Working Board size
21"x24"
Max. Board overall thickness for 4, 6, 8, 10L
157 mil
Min. Board overall thickness for
4L: 14 mil
6L: 21 mil
8L: 31 mil
10L: 39 mil
Min. trace width / space
Inner Layer: 3/3 mil
External Layer: 3/3 mil
Min SMD Width
8 mil
Board Warp
<7/1000 mil
Registration tolerance
Layer to Layer: 3 mil
Solder mask: 4 mil
Min. Finish Hole size (Mechanical drill)
5 mil
Min. buried via size
8 mil
Min Micro via Hole Size (Laser Drill)
4 mil
True Hole Position
±2 mil
Finish Hole Size Tolerance
PTH: ±3 mil
NPTH: ±2 mil
Aspect Ratio(Mechanical drill)(Board Tks/Drill Hole Size)
9 mil
Heavy Copper
Inner Layer: 5 oz
Outer Layer: 4 oz
HDI Capability
1+1+N+1+1
Outline Tolerance
± 0.005"
Controlled Impedance(Single ended & differential)
± 10%
Materials
FR4 TG135, TG150, TG170, TG180 Non Dicy
Halogen Free, RCC, Thermal Conductive Material (LED product)
1/4oz, 1/3oz to 5oz copper foil
Surface finish
Immersion Silver, Immersion Gold, Immersion Tin, OSP
Selective Gold Carbon Ink, Leadfree HASL
